发明名称 Thermosetting resin composition.
摘要 <p>A thermosetting resin composition comprises (a) a preliminary reaction product of a polyamino compound and an unsaturated bismaleimide compound, (b) an epoxy group-containing vinyl compound, (b min ) a vinyl group-free aliphatic or aromatic halogenated epoxy compound, (c) an epoxy curing agent and (d) a radical polymerisation initiator as indispensable components, is light of weight and has excellent heat resistance, strength and flame retardancy.</p>
申请公布号 EP0310424(A2) 申请公布日期 1989.04.05
申请号 EP19880309111 申请日期 1988.09.30
申请人 MITSUI PETROCHEMICAL INDUSTRIES, LTD. 发明人 KAMEYAMA, MASAO;KUMAGEWA, SHIGEYUKI
分类号 C08G59/32;C08F283/04;C08F283/10;C08G59/20;C08G59/40;C08K3/22;C08K7/14;C08K7/28;C08L63/00 主分类号 C08G59/32
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