发明名称 |
Thermosetting resin composition. |
摘要 |
<p>A thermosetting resin composition comprises (a) a preliminary reaction product of a polyamino compound and an unsaturated bismaleimide compound, (b) an epoxy group-containing vinyl compound, (b min ) a vinyl group-free aliphatic or aromatic halogenated epoxy compound, (c) an epoxy curing agent and (d) a radical polymerisation initiator as indispensable components, is light of weight and has excellent heat resistance, strength and flame retardancy.</p> |
申请公布号 |
EP0310424(A2) |
申请公布日期 |
1989.04.05 |
申请号 |
EP19880309111 |
申请日期 |
1988.09.30 |
申请人 |
MITSUI PETROCHEMICAL INDUSTRIES, LTD. |
发明人 |
KAMEYAMA, MASAO;KUMAGEWA, SHIGEYUKI |
分类号 |
C08G59/32;C08F283/04;C08F283/10;C08G59/20;C08G59/40;C08K3/22;C08K7/14;C08K7/28;C08L63/00 |
主分类号 |
C08G59/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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