| 摘要 |
A component lead cutting and forming apparatus for axial lead electronic components respectively having first and second leads secured to tape, including bending dies for supporting the first and second leads of an axial lead component in process. The bending dies are supported by slide blocks, and strain relief clamps selectively clamp the first and second leads against the bending dies. First and second parallel carriage blocks, which are adjustable in separation, support the slide blocks. Driving apparatus including an air cylinder translates the slide blocks between a first position and a second position in a linear direction generally orthogonal to the orientation of the axial leads of the component in process, and further controls cutting blades for cutting the leads of the component in process. The cutting blades are secured in parallel cutting blade support blocks which are adjustable as to separation. Bending rollers supported by the carriage blocks cooperate with the bending dies to bend the leads of the axial lead component in process as the slide blocks are linearly translated from the first position to the second position. When the slide blocks are in the second position, grippers grasp the processed component legs and translate the component for robotic pick-up presentation.
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