| 摘要 |
A test socket (10) for a leadless chip carrier (13) having a rigid guide frame (21) for holding a resilient connector member (23), and for assuring correct alignment of the chip carrier (13). The assembly is mounted on a printed wiring board (22), and the resilient connector member (23) has a pattern of conductive strips (31) that make contact to the chip carrier (13) at the top, and make contact to the printed wiring board (22) at the bottom. A vacuum is selectively applied to a hole (35) in the printed wiring board (22) to seal the chip carrier (13) against the resilient connector member (23).
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