| 摘要 |
PURPOSE:To obtain a semiconductor chip package allowing the semiconductor chip to be mounted on an external device without deviations in position by forming a hole for positioning the semiconductor and a hole for positioning a package base with respect to the external device in one of ceramic boards. CONSTITUTION:A package is so formed that ceramic boards 20, 21, 22, 23 are stacked to form a package base. Holes 21a, 21b formed on the ceramic board 21 are simultaneously formed by the same metallic mold. Accordingly, no deviation is caused in holes 21a, 21b. A positioning mark 25a is formed on the hole 21b by metallization 25, the mark 25a and the hole 21b, both formed by self matching, do not relatively deviate. According to the constitution, a semiconductor chip 26 is mounted with the mark 25a as a reference, and when the semiconductor is mounted on in external device while positioning with the hole 21a as a reference, the chip 26 is positioned with respect to the external device with high accuracy. |
