| 摘要 |
A surface-mount-technology repair station and method for replacing components on SMT circuit boards. The station includes a base with a controllable heating element through which deionized air is blown onto the surface of a board opposite to the surface on which the repair is to be effected. This raises the temperature of the entire board substantially but to a point below the melting point of solder. A second heating element through which deionized air is blown is positioned over the leads of a selected component positioned on the board, that is either to be removed from or secured to the board. The heating of the leads by the second heating element causes the solder on these leads to melt, thus, enabling replacement of the component. To remove the component, the operator, using an instrument, such as tweezers, grasps the component and removes it from the board. To install a component, the operator, after melting solder on the leads, discontinues the heating of the component. The method of the present invention includes the steps of heating the surface-mount-technology boards to a substantially high temperature, and then heating the leads of a selected component to be replaced so that the solder disposed on the leads melts.
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