| 摘要 |
PURPOSE:To enable a support substrate to be peeled off easily, by forming a metal layer highly adhesive with glass in the outer periphery of the support substrate vitreous at least in the surface, by providing a copper layer, and by forming thereon a multilayer wiring consisting of wiring conductor and insulating resin. CONSTITUTION:A chromium layer 2 is deposited at the end of a glass substrate 1 using a metal mask open at a desired part. Next, a copper layer 3 is formed on the surfaces of the glass substrate and the chromium. Photoresist is laminated or applied on the surface of the copper layer 3 to form a resist layer, and a resist pattern is formed by exposure and development; then, the resist is peeled off by copper plating to form an interlayer connection metal column 4. After a polyimide layer 5 is provided, the polyimide is flattened to allow the interlayer connection metal column 4 to be exposed. Next, wiring conductor 6 is formed. such steps are repeated required times to allow a multilayer structure. A part finally forming the product is peeled off from the glass substrate, thus obtaining a single-copper-clad polyimide multilayer wiring board 7. |
