| 摘要 |
PURPOSE:To minimize air which remains within a resin of a package and to prevent generation of defective voids by simultaneously forming a dummy molding which is connected to a plastic package when such plastic package is formed, and by discharging the air present during the forming work from such dummy molding. CONSTITUTION:First, a lead frame into which a semiconductor pellet is assembled is set inside a metallic frame of a mold. In the mold a molding in which to form a dummy molding is formed in addition to a molding in which to form a regular package. Both moldings are connected through a connecting part, a resin injecting hole being bored in the molding of the package and an air discharging hole being bored in the molding of the dummy molding, respectively. By compression injecting a resin such as an epoxy resin or a silicon resin, which has been preheated to increase the fluidity, from the resin injecting hole into the metallic frame using a press or the like, the plastic package and the dummy molding to be connected thereto are formed, and at the same time the air within the resin is discharged from the air discharging hole. |
