| 摘要 |
PURPOSE:To enable a support substrate to be peeled off easily, making the outer periphery and/or side wall of the support substrate vitreous at least in the surface rough, and the other part smooth, by providing the support substrate with a copper layer, and by forming thereon a multilayer wiring consisting of wiring conductor and insulating resin such as polyimide. CONSTITUTION:The side wall and the substrate end of a glass substrate 1 having a smooth surface 2 are made rough 3 with a rotary whetstone. Next, a copper layer 4 is formed on the surface of the glass substrate and on the side wall. A resist layer is formed on the surface of the copper layer 4 and turned into a resist pattern by exposure and development, and a part free of resist is plated with copper; then, the resist is peeled off to form an interlayer connection metal column 5. After a polyimide layer 6 is provided, the polyimide is flattened to allow the interlayer connection metal column 5 to be exposed, resulting in formation of wiring conductor 7. Such steps are repeated required times to allow a multilayer structure. Then, a part finally forming the product is peeled off from the glass substrate, thus obtaining a multilayer wiring board 8. |
