发明名称 ULTRASONIC BONDING TOOL FOR MANUFACTURING SEMICONDUCTOR
摘要 PURPOSE:To simultaneously prevent a heat rack and a crack under a pad from occurring and to prevent the positions of wirings from being irregular by providing two faces of a flat part and a conical cave for receiving wirings on the lower end face of a bonding tool body. CONSTITUTION:A guide hole 1b for guiding a wiring 4 is obliquely formed on the rear end of a bonding tool body 1 toward its lower end face 1a. In this case, the front end of the lower end face 1a is formed in a flat part 1c, the rear end is formed in an arclike conical cave 1d for receiving the wiring 4, and chamfers 2, 3 are formed at the front and rear ends of the body 1 including them. Accordingly, thus, the flat part 1c of the body prevents a pad from cracking thereunder, and the cave 1d prevents its heel from cracking, thereby preventing the position of the wiring from being irregular.
申请公布号 JPS6489335(A) 申请公布日期 1989.04.03
申请号 JP19870245236 申请日期 1987.09.29
申请人 NEC KYUSHU LTD 发明人 TOBASE HIROMORI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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