| 摘要 |
PCT No. PCT/JP88/00842 Sec. 371 Date Apr. 17, 1989 Sec. 102(e) Date Apr. 17, 1989 PCT Filed Aug. 25, 1988 PCT Pub. No. WO89/01873 PCT Pub. Date Mar. 9, 1989.Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficiently. The integrated circuit element (12) is mounted on one surface of the thin metal plates (11) having the other surface which at least part serves as a plurality of external connecting terminals (11a) and, on one surface side, the integrated circuit element (12) is covererd with a sealing resin (15). |
