| 摘要 |
PURPOSE:To enable handling operation by the contact of a wafer sucking jig only with the rear of a wafer, and to prevent the damage to the surface of the wafer by providing a wafer susceptor, the jig and a transfer means moving the wafer to a fixed position. CONSTITUTION:A susceptor 3 is overturned from a hinge section 8, and a vacuum sucking jig 10 as a handling jig is passed through a through-hole 7 bored to the susceptor 3. On the other hand, a wafer 5 is placed onto a fork 9 while the crystal growth face of the surface is directed upward, and being forwarded from a pretreatment process. The nose section of the vacuum suction 10 is made to collide with the rear of the wafer 5, and the rear of the wafer is sucked under a vacuum. The fork 9 is returned to an original position while the wafer 5 is housed into a wafer housing section 4 by downward moving the vacuum suction 10. Accordingly, a contact with the surface of the wafer of the handling jig when the wafer is mounted to or dismantled from the wafer susceptor is prevented. |
