| 摘要 |
PURPOSE:To obtain an electronic circuit part using a flexible circuit substrate capable of manufacturing a small-sized device product by coating a circuit wiring layer of copper formed onto a flexible organic resin layer as a base substrate with gold plating through a nickel plating layer of a specific thickness. CONSTITUTION:A Cu foil 13 as a conducting path is stuck onto a base member 11 through an adhesive material 12 in thickness of 15-20mum, and the thickness of the Cu foil 13 is kept within a range of 10-30mum determined by bending properties and mechanical strength generating no lead break. Ni plating 14 is shaped within a range of 5-7mum to a section, on which an electronic part such as an IC for drive as at least a chip part on the conducting path consisting of the Cu foil 13 is mounted, and a wire bonding section. The base member 11 on which the Cu foil 13 as the conducting path is stuck is coated with an organic film 16 for protection by using an adhesive material 17 with the exception of a section required for connection. |
