发明名称 BONDING OF PIEZOELECTRIC CERAMIC
摘要 PURPOSE:To obtain a thin and uniform adhesive layer having excellent vibration-transmittance and to achieve sufficiently high electric conductivity between a piezoelectric ceramic and a metal, by bonding a piezoelectric ceramic with a metal under pressure using an adhesive containing a specific amount of a highly conductive metallic powder having a specific particle diameter. CONSTITUTION:An adhesive is produced by mixing (A) 100pts.wt. of an adhesive composed of one or more components selected from epoxy polymer, acrylic polymer, urethane polymer, phenolic polymer and cyanoacrylate polymer with (B) <=20pts.wt. of highly conductive metal powder having particle diameter of 1-30mum (e.g. composed of one or more metals selected from nickel, copper, aluminum, iron, silver, gold and platinum). The obtained adhesive is applied to a piezoelectric ceramic and a ring made of e.g. an iron-nickel alloy is pressed against the ceramic and bonded by curing the adhesive.
申请公布号 JPS6487679(A) 申请公布日期 1989.03.31
申请号 JP19870243242 申请日期 1987.09.28
申请人 AISIN SEIKI CO LTD 发明人 INAGAKI ASAO;NAKAI KIYOTAKA;TAUCHI HITOSHI
分类号 C09J5/00;G10K9/12;G10K9/122;H01L41/22;H02N2/00 主分类号 C09J5/00
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