发明名称 HEAT-SHRINKABLE MOLDED PRODUCT
摘要 <p>PURPOSE:To manufacture a heat-shrinkable material with appropriate strength, of good flexibility and superior oil resistance and low temperature properties, and having a good electron radiation crosslinking efficiency and being able to color a material by composing the material of crystalline epichlorohydrin resin. CONSTITUTION:A heat-shrinkable molded product is composed of crystalline epichlorohydrin resin. The epichlorohydrin resin has a chloromethyl radical and a crystalline high molecular compound with polyether bonding as a main chain, and particularly 50,000-1,000,000mol.wt. is appropriate as a shrinkable material, and 20-50% of crystallinity index is suitable. The resin of 20% or less of crystallinity index has a bad retaining ratio after cooling the oriented or expanded form by heating, lowering the performance as a heat-shrinkable material, and not preferred. The resin beyond 50% loses the low temperature properties of the heat-shrinkable material thus manufactured. The heat setting properties of said heat shrinkable molded product is as low as 70-100 deg.C, and also not shrunk in the normal temperature, and a shrinkable protective film thus manufactured is of extremely superior oil resistance and low temperature properties.</p>
申请公布号 JPS6487228(A) 申请公布日期 1989.03.31
申请号 JP19870244676 申请日期 1987.09.29
申请人 DAISO CO LTD 发明人 YOSHIMOTO HIROSHI;OMIYA HIROSHI;NAKAJIRI TSUNEO
分类号 B29C61/08;B29C55/26;B29C61/06;B29K23/00;B29K71/00;B29K105/02;C08J5/00;F16L11/12;F16L58/18;H02G15/18 主分类号 B29C61/08
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