发明名称 Device for fitting (populating) substrates with wired components
摘要 During the fitting of substrates with wired components (BE), their connecting wires (AD) are intended to be aligned in a simple manner such that the fitting can be carried out with high fitting reliability and a minimal fitting shadow. To this end, the connecting wires (AD) of the components (BE) are inserted, in an intermediate position, into associated openings (O) in a guide plate (RP), at which point a relative movement is produced between the body of the components (BE) and the guide plate (RP) which relative movement deforms the connecting wires (AD) beyond the elastic range at least once. The components (BE) are preferably held between parallel retaining jaws (HB) of a gripper (G), and the guide plate (RP) moves relative to the gripper (G). The connecting wires (AD) are aligned precisely as a result of the deformation beyond the elastic range. <IMAGE>
申请公布号 DE3731314(A1) 申请公布日期 1989.03.30
申请号 DE19873731314 申请日期 1987.09.17
申请人 SIEMENS AG 发明人 GOEPPERT,ULRICH,DR.-ING.
分类号 H05K13/04 主分类号 H05K13/04
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