| 发明名称 |
|
| 摘要 |
In this power transistor module, which is suitable for use in converter apparatuses and is to be mounted on a cooling body, a plastic frame (1) which is open at the top and bottom and a ceramic plate (5) which is bonded to the base of the frame form the housing. In order to achieve a low thermal resistance, the ceramic plate (5) is connected on both sides directly, that is to say without soldering or bonding, to metallisations (6a, b, c, 7), the metallisations being structured inside the housing to correspond to the circuit which is to be implemented, and is [sic] soldered to connecting elements (10, 12, 17) which are accessible externally on the top of the module and to one or more power transistors (14). The metallisations have a larger area than that which corresponds to the soldering surfaces on the semiconductor components. The connection between the control connection and one of the main connections of the transistor (14) and the corresponding metallisations takes place by means of internal connecting wires. The module is filled with potting compounds (15, 16) for mechanical protection and for electrical insulation. …<IMAGE>… |
| 申请公布号 |
DE3241508(C2) |
申请公布日期 |
1989.03.30 |
| 申请号 |
DE19823241508 |
申请日期 |
1982.11.10 |
| 申请人 |
ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE |
发明人 |
LEUKEL, BERND, DIPL.-ING., 6940 WEINHEIM, DE;BUNK, KLAUS, 6520 WORMS, DE;HETTMANN, HUBERT, 6832 HOCKENHEIM, DE |
| 分类号 |
H01L23/053;H01L23/24;H01L25/07;H01L25/18 |
主分类号 |
H01L23/053 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
