| 摘要 |
<p>PURPOSE:To make it possible to laminate wiring boards without enlarging the flow of the bonding resin of adhesive material by a method wherein the wiring boards are put one upon the other through the adhesive material, which is heat-bonded in advance on one wiring board, under heat and pressure. CONSTITUTION:An adhesive material 2 formed out of bonding prepreg, which is produced by impregnating base material such as glass woven fabric or glass non-woven fabric with thermosetting resin and, after that, semi-hardening, is put upon one wiring board 1b and heated and pressurized, when necessary, for bonding in advance to each other. The wiring board 1b is put onto the surface of a wiring board 1a under the state that the recessed part 6 and the bonding parts 7 of the circuits 5 of the wiring board 1a locate in the opening part 3 of the wiring board 1b so as to be formed under heat and pressure in order to integrally laminate the wiring boards 1a and 1b through the adhesive material 2 and consequently obtain a multi-layer wiring board A. Next, circuits 9 are formed in the metal foil 8 of the wiring board 1b, and a semiconductor chip 4 such as an IC chip or the like is loaded and mounted in the recessed part 6 and finally the chip 4 and the circuits 5 and 9 are electrically connected in order to produce a semiconductor package.</p> |
