| 发明名称 |
A printed wiring board. |
| 摘要 |
<p>The invention relates to a printed wiring board (13) which forms circuit conductors (11) on one or both surfaces of a base plate (10). A heat radiating film (12) formed of paste of heat radiating material covers the circuit conductors (11). Thus, heat produced in the circuit conductors (11) is effectively dissipated.</p> |
| 申请公布号 |
EP0308576(A2) |
申请公布日期 |
1989.03.29 |
| 申请号 |
EP19880105342 |
申请日期 |
1988.04.02 |
| 申请人 |
NIPPON CMK CORP. |
发明人 |
KAWAKAMI, SHIN;HARUYAMA, SATOSHI;OKONOGI, HIROTAKA;NIKAIDO, KATSUTOMO;MUKAI, NORITO |
| 分类号 |
H05K1/02;H05K3/24;H05K3/28;H05K7/20 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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