| 摘要 |
<p>PURPOSE:To improve a device in heat radiation and enable the installation of a semiconductor chip consuming much power by a method wherein the rear side of a substrate mounted with a semiconductor chip is kept free of resin. CONSTITUTION:A substrate 1 with lead pins 2 inserted thereinto is mounted with a semiconductor chip 3 through the intermediary of an adhesive agent 4 and a wire 6 connects the electrodes of the semiconductor chip 3 to a wiring 5 in the substrate 1. A resin 12 is employed to encapsulate the entirety, with some of the pins 2 and the lower surface of the section of the substrate 1 mounted with the semiconductor chip 3 being allowed to remain exposed. A copper plate 13 is bonded to the lower surface of the substrate 1. The surface is plated with nickel and gold or coated with solder resist. With the lower surface being exposed of the section of the substrate 1 mounted with the chip 3, radiating capability is enhanced. This design enables the installation of a chip 3 consuming much electric power.</p> |
