发明名称 METHOD OF SEALING CAPACITOR BUSHING
摘要 PURPOSE: To enable soldering without carrying out electroplating, by applying a first coating film of thick-film ink onto a capacitor bushing, then applying a second coating film of thick-film ink onto the upper surface of the first coating film, and firing and soldering the bushing. CONSTITUTION: A region of a porcelain bushing to be coupled is coupled to a porcelain by applying a first coating film containing a large quantity of frit and a small quantity of silver. Then, a second coating film containing a large quantity of silver and a small quantity of frit is applied onto the upper surface of the first coating film. The second coating film is coupled with the adjusted first coating film, and a solder alloy is easily coupled with the second coating film. The bushing after coating is fired under carefully controlled conditions. As a result, crack of the porcelain bushing is prevented, thus securing coupling of the thick-film ink or coating material with the porcelain. Then, a cap at an end portion and a container cover are soldered to the bushing by ordinary means.
申请公布号 JPS6482609(A) 申请公布日期 1989.03.28
申请号 JP19880207995 申请日期 1988.08.22
申请人 COOPER IND INC 发明人 JIEIMUZU ROI BANISUTAA JIYUNIA;JIYURIAN UESURII HOORU JIYUNIA;JII JIEI ROOZENBAAGAA
分类号 H01G4/236;H01G2/10;H01G13/00 主分类号 H01G4/236
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