| 摘要 |
PURPOSE:To prevent pads from corroding due to the absorption of moisture of a sheath resin by providing insulating films on the surfaces of an IC chip, wirings and a mounting substrate. CONSTITUTION:A die pad 8 for placing an IC chip 2 formed with a hybrid integrated circuit and a plurality of wire bonding pads 9 are provided on a mounting substrate 1. A passivation film 3 and a plurality of aluminum pads 4 are provided on the surface of the chip 2. After the pads 4 are connected to the pads 9 by wirings 5, SiO2 oxide films 6 are formed on the surfaces of the chip 2 including the pads 4, the wirings 5 and the substrate 1. Thereafter, the substrate 1 is covered with the wirings 5 and the chip 2, and a sheath resin 7 is formed. Even if moisture is invaded from externally to the resin 7, the films 6 can prevent the pads 4 of the chip 2 from corroding. |
