发明名称 Low impedance interconnect method and structure for high frequency IC such as GaAs
摘要 A method and structure are disclosed for mounting and connecting an electronic device such as an integrated circuit to a circuit board. The board has a plurality of embedded shielded conductors for interconnecting the integrated circuit to other devices on the board. In order to limit the capacitance and inductance of the connection, the integrated circuit is mass bonded directly to the conductors and to their coaxial shields.
申请公布号 US4816967(A) 申请公布日期 1989.03.28
申请号 US19870117372 申请日期 1987.10.28
申请人 发明人
分类号 H01L23/538;H01L23/66;H05K1/02;H05K3/40;(IPC1-7):H05K7/02 主分类号 H01L23/538
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