| 摘要 |
PURPOSE:To produce a wafer having a uniformly bonded surface, by applying a wax to the whole surface of the wafer in such a manner that the applied wax is interspersed at equal distances, putting the wax-coated surface of the wafer on a surface of a carrier plate, melting the wax and subsequently pressing the wafer. CONSTITUTION:A wax 3 is applied to the whole surface of a wafer 2 in such a manner that the applied wax 3 is interspersed at equal distances. The wafer 2 is put on a surface of a carrier plate 4 such that the wax-coated surface of the wafer 2 is brought into contact with the terminal surface of the carrier plate 4. Subsequently, the wax 3 is melted and the wafer is pressed on the carrier plate 4 to bond the wafer to the carrier plate 4. |
