| 摘要 |
PURPOSE:To form a photodetector IC which does not erroneously operated with a light by covering other surface than the surface of a package corresponding to a photodetector element with light opaque dye. CONSTITUTION:A photodetector IC pellet 3 is mounted on a lead frame 2, sealed with resin and molded. In this case, the surface of a resin package corresponding to a photodetector element 31 of the pellet 3 is formed in a protruding shape. Then, the package 4 is coated with light opaque dye. Then, the coating film 6 of the end face 51 of a protrusion 5 is removed. Thus, it can prevent the IC from erroneously operating due to the irradiation of a light to the IC.
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