发明名称 METHOD AND APPARATUS FOR FORMING THICK-FILM CIRCUIT
摘要 <p>PURPOSE:To always accurately control a size between a nozzle and a substrate by a method wherein a nozzle tank holding material capable of being shifted further in an upward and downward direction is installed at an elevating material, a spring pressurizes this nozzle holding material downward and a solenoid regulates an upward and downward movement of the holding material. CONSTITUTION:When a tip part of a nozzle 44 is shifted to a drawing start position, a nozzle holding material 28 is pressurized downward by a spring 32. Then, when an elevating material 24 is lowered by a prescribed value, the tip part of the nozzle 44 presses a substrate 48 by a definite elastic force and the spring 32 is contracted up to a prescribed position. When a solenoid 52 is opened, a fixing material 54 holds the material 28 in the position. After that, the material 28 together with the material 24 is raised by the prescribed value; an interval between the nozzle 44 and the substrate 48 is regulated; a drawing operation on the substrate 48 is executed. When the drawing operation is completed, the material 28 is shifted further upward simultaneously with the material 24. After that, when the solenoid is closed, the material 28 is pressurized downward to its initial position by the spring 32.</p>
申请公布号 JPS6481294(A) 申请公布日期 1989.03.27
申请号 JP19870237959 申请日期 1987.09.22
申请人 JUKI CORP 发明人 TAGUCHI KATSUHIKO
分类号 B41J2/335;H01B13/00;H01C17/06;H01L21/00;H05K3/10;H05K3/12 主分类号 B41J2/335
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