| 摘要 |
<p>PURPOSE:To enhance the production efficiency of a thick film hybrid IC, by providing a structure for changing a printing condition during a single printing process so as to be fitted to a desired printing film thickness. CONSTITUTION:A computer 15 having printing conditions registered therein outputs control data, which controls a worktable 19, a printing pressure part 26 and a printing speed control part 30 plurally in the order of a plurality of resistor elements under mutually different printing conditions corresponding to the respective resistor elements, within a single process moving a squeegee 29 prescribed direction on the basis of the input data of the computer part 15. As a result, the worktable 19 is moved up and down to control the gap between a printing screen 16 and an article 2 to be printed and a prescribed printing pressure is applied to the printing screen 16 in the printing pressure part 26. At the same time, a printing film thickness is controlled by the printing speed corresponding to the printing position and pattern preliminarily programmed by the printing speed control part 30 and a resistor element having an arbitrary printing film thickness is printed on a thick film hybrid IC substrate in a single printing process.</p> |
