| 摘要 |
<p>PURPOSE:To form a sharp angle which is formed with a cutting surface and a wafer surface by dicing by means of a dicing blade with two blade surfaces of respectively different cutting resistance. CONSTITUTION:Two blade surfaces constituting of a dicing blade are formed with abrasive grains of different diamond particle diameters and respective surfaces are made rough or fine particulate surfaces. Such a dicing blade 35 is mounted on a spindle shaft 37, and a wafer applied is cut on a dicing table 13 while pure water is sprayed as is carried out conventionally after setting the number of revolutions of the shaft and the cutting speed. Then, a second kerf 41b is formed by revolving the whole wafer by 180 deg. and cutting similarly. As the dicing blade is cut in the curved state, a sharp angle is formed with a cutting surface and a wafer surface, and it is not necessary to use an exclusive machine of reverse trapezoid.</p> |
