| 摘要 |
<p>PURPOSE:To prevent a defect due to a short circuit between a header and a lead frame and to prevent a detect due to a short circuit between the lead frame and a lead by a method wherein an insulating film is formed from the rear to the side of an inner lead part of the lead frame. CONSTITUTION:A lead frame 2 is caulked (fixed) onto a header (a heat- dissipating plate) 1 by using a rivet 3. An inner lead part 4, a dam 5, an outer lead part 6 and a frame 7 are provided at the lead frame 2. An end part of the frame 7 is caulked onto the header 1. A tip part of the inner lead part 4 is covered with an insulating film 8 from its rear to its side. The tip part of the inner lead part 4 and an electrode of a semiconductor element (a chip) which has been fixed to a tab part 9 on the header 1 by using a brazing material such as a solder or the like are wirebonded by using a wire 11 for connector use.</p> |
