| 摘要 |
PURPOSE:To simplify process, reduce material cost, and improve reliability and packaging density by forming a lead wire corresponding to a tape carrier lead previously and by attaching a semiconductor chip directly to it, by thermal pressure bonding. CONSTITUTION:A lead wire 2 is formed on the upper surface of a substrate for packaging. Plurality of grooves 3 are formed on the substrate for packaging with a certain gap between them, a tip 4 of the lead wire 2 is allowed to protrude within it, and a bump 5 is formed at the lower part of the tip 4. Bonding pad of a semiconductor chip 6 and the bump 5 are subject to thermal pressure bonding and the tip 4 of the lead wire 2 and the semiconductor chip 6 are subject to gang bonding. By thermal pressure bonding, semiconductor chips 6 are attached to the lead wire 2 formed on the substrate for packaging 1 to form a tape carrier module 7. The 8 indicates an external connection terminal provided at the substrate for packaging and 9 does a wiring. After the thermal pressure bonding, a resin for sealing 10 is subject to potting to allow the semiconductor chips to be sealed. |
