| 摘要 |
PURPOSE:To increase heat dissipation effects and to improve reliability of a semiconductor device by forming a semiconductor element mounting device with one of metallic leads for connection to external circuits. CONSTITUTION:Thin conductive layers 2A, 2B, and 2C which are approximately 12mum thick are formed upon a ceramic material 1, metallic leads 3A and 3B which are approximately 0.2mm thick are brazed thereupon, while the metallic lead 3B is formed to be integrated with an element mounting part 5 upon which to mount a semiconductor element 6. The area of the metallic lead 3B gets increased at the element mounting part. The semiconductor element 6 is mounted at the element mounting part 5. Heat generated at the time of operating the element is radiated as shown by arrow 20B to the ceramic material 1 after being spread over to the metallic lead 3B which is a good conductor, whereby a heat dissipation area at the time of heat dissipation into the ceramic material 1 is increased and the heat dissipation effects are accordingly increased. Therefore the quantity of heat to be accumulated in the semiconductor element 6 is greatly reduced.
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