| 摘要 |
<p>PURPOSE:To manufacture resin sealed semiconductor devices without a chip attachment process by using a lead frame modified in the structure, and providing a vacuum sucking hole in the wire bonding machine to directly suck and fix a semiconductor chip. CONSTITUTION:In a predetermined position of a heater block 5 where a semiconductor chip 3 is to be mounted, a vacuum sucking hole 6 smaller than the semiconductor chip 3 is provided. Since this vacuum, sucking hole 6 is evacuated through an evacuation port 7, the semiconductor chip 3 can directly be fixed onto the heater block 5. And, the electrode of the semiconductor chip 3 and the end part of the inner leads 1b of the lead frame are connected by a gold wire 2. Then, a transfer resin sealing equipment is used to seal with a molding resin the central part of the lead frame on which the semiconductor chip 3 is mounted. Finally, using a continuous lead forming machine, the tie bars 1c are removed to shape the outer leads 1d into a predetermined configuration.</p> |
