| 摘要 |
<p>PURPOSE:To mount a tab so as not to rotate when resin flows in, by arranging leads for suspending the tab which slip from center positions of respective shorter sides on the shorter sides which are facing in the rectangular tab. CONSTITUTION:A 4M bit DRAM semiconductor chip 20 is equipped on the surface of a tab 11 through adhesives. External terminals 24 of the semiconductor chip 20 are connected to inner leads 12 through bonding wires 3. The tab 11 allows the leads l4C-F for suspending its tab to be arranged in the vicinity of center of its longer sides and also the leads 14A and B for suspending the tab to be arranged at positions which slip from the center of its shorter sides. The leads 14A and B for suspending the tab are formed each other at the positions of point symmetry with respect to the center of the tab 11. Resin for sealing 4 is injected from an inflow port 4A which is prepared on one shorter side. Since the tab 11 does not rotate when resin flows in, this system prevents the shortcircuit and disconnection of bonding wires.</p> |
