| 摘要 |
<p>PURPOSE:To prevent the crack development of a resin sealed part and improve a resistance to moisture, by preventing separation of sealed resin and a tab after preparing an opening at the center part of the tab, thereby checking the outflow of adhesives after preparing slots at the surface of the tab. CONSTITUTION:A 4 M bit DRAM semiconductor chip 20 is equipped on the surface of a tab part 11 through adhesives 1. External terminals 24 of the semiconductor chip 20 are connected to inner leads 12 through bonding wires 3. An opening 11A having a width A is formed at the tab part 11. Then, when solderreflow is performed, resin does not strip off from the rear of the tab 11, even though moisture in a resin sealed part 4 changes to vapor to produce vapor pressure. Then, this system prevents the crack development of the resin part 4 and can improve a resistance to moisture. Moreover, as the slots 11c are prepared at the surface of the tab part 11, the adhesives 1 do not flow out to the side faces or the rear of the tab part 11. This situation improves bonding strength between the side faces or the rear of the tab part 11 and the resin part 4 and then, ensures that the crack development of the resin part can be avoided.</p> |
