| 摘要 |
PURPOSE:To improve the mirror surface flatness of a printing circuit board after a polishing process by applying a ring shape to a polishing pad in such a way that the printing circuit board when positioned at the innermost and outermost sides with the rotation of a rotary holder does not come in contact with the internal and external surfaces of the pad. CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. Consequently, the flatness of the mirror surface of the board 6 after polishing is substantially improved. |
