SUBSTRATE STICKING METHOD

摘要

PURPOSE:To prevent fluctuation of the thickness of wax by mounting a base having a substrate temporarily sticked through wax onto a cooling stage then cooling and sticking while pressurizing the substrate thereby making the wax layer uniform and sticking perfectly. CONSTITUTION:Direction of orientation flat is regulated through rotation of a chuck 4 and a wafer 1 on the first spin chuck 4 is mounted onto a second spin chuck 6 through a first inverter 5. Then the wafer 1 on the chuck 6 is directed upside down and wax is dripped through a dripping device 7 and formed into a film through rotation of the chuck. Then the waxed wafer 1 is inverted by a second inverter 8 and mounted on a base 9, thereafter pressed and bonded temporarily by means of an elastic stamp 11 on a heating stage and pushed to the outside to be bonded uniformly air sump. Finally, the base 9 temporarily adhered with the wafer 1 is pressed by means of a wafer press 14 on a cooling stage 13 so as to cool and stick the wafer 1.