摘要 |
PURPOSE:To provide freedom in layout design, by attaching a collimate lens, which makes the light that is emitted from a semiconductor light emitting element to be the parallel light, to the very close part of the semiconductor light emitting element. CONSTITUTION:An ultraviolet-ray hardening resin is dropped in a recess part 19. Ultraviolet rays are projected. A lens part 20 is fixed to the recess part 19 of a main body 11 of a package. In this way, a collimate lens 17 is attached to the very close part of a semiconductor laser element 14. The laser light, which is emitted from the semiconductor laser element 14, is made to be the parallel light through the collimate lens 17, which is provided in the very close part of the semiconductor laser element 14. The light passes a through hole in a lens holding member 18. The laser light, which has passed the through hole becomes the parallel beam light. When there is no obstruction at the part of the beam diameter, the interval between the semiconductor laser element 14 and an optical fiber can be made wide to any degree. As a result, freedom can be provided in layout design. |