| 摘要 |
<p>PURPOSE:To obtain a wafer taking out/housing device capable of performing a correct operation at low cost by a method wherein the device is provided with a means for moving up and down selectively a wafer housing container and an arm, a means for detecting the relative upper and lower positions of the above both and a means for controlling the above vertically driving means on the basis of a signal from this detecting means. CONSTITUTION:In case an Nth-stage wafer is taken out of the interior ot a carrier 3, a carrier elevator 2 is controlled to make the carrier 3 ascend and descend and when the position under the Nth-stage wafer is detected by a photoelectric sensor 10, the carrier is once stopped there, subsequently this is made to ascend and when the sensor 10 detects the position over the Nth- stage wafer, the carrier is again stopped and an attracting arm 12 is inserted under the lower side of the Nth-stage water 4. Then, the carrier 3 is made to descend and when the sensor 10 detects the position under the Nth-stage water, the carrier is stopped to place the wafer 4 on the arm 12, subsequently the wafer 4 is attracted, is pulled cut outside of the carrier 3 and the taking-out of the wafer is completed. Moreover, in case the wafer 4 is housed, the housing is performed in the reverse order of the above operation.</p> |
