| 摘要 |
PURPOSE:To obtain the titled composition suppressing stress low without damaging water vapor resistance and heat resistance, by blending a composition consisting of an epoxy polymer, a specific butadiene-based polymer and a phenolic curing agent with a specific amount of an inorganic filler. CONSTITUTION:100pts.wt. novolak type epoxy polymer is blended with (A) 5-30pts.wt. butadiene-based polymer which is shown by the formula (R and R2 are H or hydrocarbon; x and z are positive integer; y is 0 or positive integer and 0<=y/x<=1), has >=5,000mol.wt. and 5-25(KOHmg/g) acid value, (B) 25-75 pts.wt. phenolic curing agent, (C) 0.5-5pts.wt. curing promoter and (D) 0.1-15 pts.wt. coupling agent and further (E) 50-85% based on the total composition of an inorganic filler. Extracted water obtained by extracting the butadiene polymer has <=25muS/cm electric conductivity. |
