发明名称 COMBINED PLATING METHOD
摘要 PURPOSE:To impart excellent electrical conductivity and heat radiation characteristic to an arbitrary part of an Mg base material by subjecting the surface of said material to activation and Zn substitution treatments, then combining electroless plating and electroplating and plating Cu, Ni and Au successively onto said surface. CONSTITUTION:The surface of the Mg (alloy) base material is degreased and is pickled with an aq. soln. contg. chromate; thereafter, the surface is subjected to the activation treatment and the Zn substitution treatment. The surface is then subjected successively to Cu electroless plating, Ni electroless plating, Cu electroplating, and Au electroplating or Cu electroless plating, Ni electroless plating, Cu electroplating, Ni electroplating, and Au electroplating. The throwing power in threaded hole parts, the corner parts of inside surfaces, etc., is improved and the corrosion resistance is improved by the electroless plating. The excellent electrical conductivity, heat radiation characteristic and corrosion resistance are obtd. by the electroplating.
申请公布号 JPS6475696(A) 申请公布日期 1989.03.22
申请号 JP19870234203 申请日期 1987.09.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAKURA YOSHINORI
分类号 C23C18/18;C23C18/31;C23C18/34;C23C18/40;C23C18/52;C23F17/00;C23G1/10;C25D5/10;C25D5/12;C25D5/24 主分类号 C23C18/18
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