| 摘要 |
PURPOSE:To completely eliminate a resist film even if depth of a recessed part is above two times of its width by immersing a stamper into a peeling liquid to which an ultrasonic wave is applied and eliminating the resist film adhering to its surface thereby. CONSTITUTION:A peeling liquid 5 is stored in a cleaning tank 6 and an ultrasonic generation source 7 is installed therein. At the time of eliminating a resist film, the peeling liquid 5 is heated, and also, an ultrasonic wave is generated by the ultrasonic generation source 7, and a stamper 1 adhered with a resist is immersed into its peeling liquid 5. In such a way, by installing the ultrasonic generation source 7 into the peeling liquid 5 stored in the cleaning tank 6 and immersing the stamper 1 into the peeling liquid 5 to which an ultrasonic wave is applied, the resist film can be eliminated completely even if depth of a recessed part is above two times of its width. |
