Solder precipitating composition and method of precipitating solder.
摘要
<p>A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition (7) is applied to a surface (1) on which the solder (8) is to be precipitated, and the solder (8) is precipitated, thereby performing soldering.</p>
申请公布号
EP0307888(A2)
申请公布日期
1989.03.22
申请号
EP19880115029
申请日期
1988.09.14
申请人
THE FURUKAWA ELECTRIC CO., LTD.;HARIMA CHEMICALS, INC.
