发明名称 Electroless copper plating solution
摘要 A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.
申请公布号 US4814009(A) 申请公布日期 1989.03.21
申请号 US19870119861 申请日期 1987.11.13
申请人 NIPPONDENSO CO., LTD. 发明人 KONDO, KOJI;MURAKAWA, KATUHIKO;NOMOTO, KAORU;ISHIKAWA, FUTOSHI;ISHIDA, NOBUMASA;ISHIKAWA, JUNJI
分类号 C23C18/40;(IPC1-7):C23C18/40;B05D1/18 主分类号 C23C18/40
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