发明名称 |
Electroless copper plating solution |
摘要 |
A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.
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申请公布号 |
US4814009(A) |
申请公布日期 |
1989.03.21 |
申请号 |
US19870119861 |
申请日期 |
1987.11.13 |
申请人 |
NIPPONDENSO CO., LTD. |
发明人 |
KONDO, KOJI;MURAKAWA, KATUHIKO;NOMOTO, KAORU;ISHIKAWA, FUTOSHI;ISHIDA, NOBUMASA;ISHIKAWA, JUNJI |
分类号 |
C23C18/40;(IPC1-7):C23C18/40;B05D1/18 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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