| 摘要 |
PURPOSE:To secure reliable connecting conditions by forming a preliminary solder plating layer having a specific composition ratio in a lead, immersing them in a soldering bath of low melting point and truly connecting them after an outer electrode and the lead are preliminarily connected. CONSTITUTION:The edge of a lead 2 fixed on a folder 1 every pair is immersed in a flux bath 3, next, soaked in a high temperature soldering bath 4 having composition ratio of silver of 3-8wt.% and lead of 97-92wt.% and a preliminary soldering plating layer 5 is formed on the edge of the lead 2. Next, it is immersed in a flux bath 6, thereafter a laminated ceramic capacitor element assembly 8 on which an outside electrode 7 is abutted between preliminary solder plating layers of the lead 2 is sandwiched, a soldering copper 10 controlled at 320 deg.C+10 deg.C is pressed from both sides after preliminary heat 9, a preliminary solder plating layer 5 is melted and preliminary connection is performed. Next, after the laminated ceramic capacitor element assembly 8 is immersed in a flux bath 11 and heated preliminarily 12, it is soaked in a solder bath 13 of low melting point of 230 deg.C and connected truly. |
