发明名称 THERMOSETTING PHENOLIC RESIN COMPOSITION
摘要 PURPOSE:To obtain the title low-smoking composition excellent in storage stability and adhesiveness, by mixing a specified thermosetting phenolic resin with an epoxy resin and an organic solvent. CONSTITUTION:A phenol is brought into contact with an HCl-HCHO bath having an HCl concentration of 5-28wt.%, an HCHO concentration of 8-25wt.% and a total concentration of HCl and HCHO of 15-40wt.% and kept at a bath ratio >=8 according to the equation to obtain a thermosetting phenolic resin (A) of a weight-average MW (in terms of PS) >=1,000 by GPC and a free phenol content (as measured by liquid chromatography) <=500ppm. Component A is mixed with an epoxy resin (B) and an organic solvent (C) (e.g., methanol) at an A to B weight ratio of 50/50-95/5 and an (A+B) to C weight ratio of 5/95-80/20.
申请公布号 JPS6474255(A) 申请公布日期 1989.03.20
申请号 JP19870230424 申请日期 1987.09.14
申请人 KANEBO LTD 发明人 KUBOTA YOSHIAKI;TSUBOUCHI SHIRO;HIRAI YOSHIAKI
分类号 C08L61/10;C08L61/04 主分类号 C08L61/10
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