发明名称 BONDING DEVICE
摘要 PURPOSE:To eliminate an individual difference due to an operator and to shorten a detecting time by a method wherein the position of a point set as a reference is held as the data on position and a bonding is performed while the correction of the data on the position of the center of rotation of a bonding stage is performed. CONSTITUTION:A camera 19 is moved with the feature of an IC chip as a mark while an image to be projected by the camera 19 is seen, the central point of a crossline on a monitor is superposed on the marked point, this image is stored as a first image data and moreover, the position of the marked point is stored as the data on position. Then, a bonding stage 14 is rotated at 180 deg., the image is stored as a second image data in the same way as the above way and moreover, the marked position is stored as the data on position. Then, the second image data is compared with the first image data stored by an image processor 15 during a bonding work, the amount of deviation is detected, the position of the marked point on the IC chip is corrected and the corrected position is stored as the corrected data on position. Then, the stage is rotated at 180 deg. and the same operation as the above one is performed. Moreover, the position of the center to rotation of the stage 14 is calculated from the corrected data.
申请公布号 JPS6473732(A) 申请公布日期 1989.03.20
申请号 JP19870233106 申请日期 1987.09.16
申请人 NEC CORP 发明人 YASUSATO TADAO
分类号 H01L21/60 主分类号 H01L21/60
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