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发明名称
LEAD BENDING DIE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPS6475120(A)
申请公布日期
1989.03.20
申请号
JP19870231527
申请日期
1987.09.16
申请人
MITSUBISHI ELECTRIC CORP
发明人
KAMIYA HIROAKI;HIGUCHI YUKIO;TSUTAI TOSHIO
分类号
B21D5/01
主分类号
B21D5/01
代理机构
代理人
主权项
地址
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