发明名称 WIRE BONDING
摘要 PURPOSE:To allow a stable bonding without heating the entire part of a work by bonding by pressuring a wire onto a second face to be bonded, energizing a part which is in contact with the tip of a wire bonding tool through a pair of electrodes formed thereon, and bonding the wire to the second face to be bonded by heating. CONSTITUTION:By forming a ball 11 at the tip of a wire 10 which passes through a bonding tool 1, the ball 11 is bonded by pressuring to a first face to be bonded by the bonding tool 1. After relatively moving the bonding tool 1 to a second face to be bonded, a wire 10 is bonded to the second face to be bonded by the bonding tool 1, and a part of the wire 10, which is in contact with the tip of the bonding tool 1, is energized by a pair of electrodes 5 and 7 formed on the tip of the bonding tool 1, and the wire 10 is bonded to the second face to be bonded by heating. For example, the electrodes 5 and 7 are connected to a welding power supply 8 by externally arranging the internal electrode 5 by forming a small diametered cylindrical part 4 on the circumference of the bottom end part of the bonding tool 1, and then by emternally arranging the external electrode 7 on the outer circumference thereof, between which on insulating spacer 6 is interposed.
申请公布号 JPS6472539(A) 申请公布日期 1989.03.17
申请号 JP19870229029 申请日期 1987.09.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MAKINO YUTAKA;YAMAMOTO AKIHIRO;KITAYAMA YOSHIFUMI;HIRANO MASATO;MATSUMURA SHINYA
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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