| 摘要 |
PURPOSE:To set the arbitrary quantity of heat and to eliminate the necessity of applying heat externally by forming a resistance heater for heating a chip to a predetermined temperature on the main surface of the chip. CONSTITUTION:A self-heating resistance region 2, a region 3 for performing the original function of a semiconductor integrated circuit, many bonding pads 4 of the integrated circuit, and a pair of pads 5, 6 for applying a voltage to the region 2 are provided on a chip 1 of the integrated circuit. The region 2 is formed on the main surface of the chip, and operated as a resistance heater. The region 2 is disposed on a region not used for the region 3 of the normally original function, i.e., a region outside the pad. The quantity W of heat of the region 2 becomes W=V<2>/R when it is represented by a voltage V applied between the pads 5 and 6, and a resistance value R between the pads 5 and 6. Accordingly, when the voltage of 10V is applied and the resistance is 10 ohms, the quantity of heat of 10W is obtained. When the quantity of heat of this degree is obtained, the chip 1 can be sufficiently held at high temperature. |
