| 摘要 |
<p>PURPOSE:To obtain a thick film resistance circuit device having a high mounting density at a low cost by forming a conductive circuit of conductive paste of polymer with metal powder coated with Ag as a conductive material. CONSTITUTION:Conductive circuits 12a, 12b are formed on a substrate 11 with polymer conductive paste with metal powder coated with Ag as a conductive material. For example, the polymer series conductive paste in which the metal powder coated with the Ag is employed as the material is printed and baked on the insulating substrate 11 to form conductor circuits 12a, 12b. The metal powder employed as the circuits 12a, 12b includes base metal, such as Cu, Ni or Al, etc., and the polymer includes epoxy, phenol resin, etc. Then, mixture of carbon powder in the epoxy or phenol resin is so printed and baked on the substrate 11 that the connecting electrodes 13a, 13b of both ends are superposed on the circuits 12a, 12b, thereby forming a polymer thick film resistor 13.</p> |
