| 摘要 |
PURPOSE: To raise the reliability and reduce the manufacturing cost by interconnecting chips with bonding wires and insulating metal plates and other internal electric elements from each other, using a resin for the capsulation. CONSTITUTION: Chips D, E, F are interconnected with bonding wires and metal plates A, B, C and other internal electric elements are insulated from each other, using a resin G for the encapsulation. The chips D, E, F soldered to the plates A, B, C are disposed in a plane so that the chips are located on the same side of the plane. On the opposite side the plates A, B, C are insulated from outside by a thin layer of the same resin as G. This raises the reliability and reduces the manufacturing cost. |
